Techniques and Challenges for 300 mm Silicon: Processing, Characterization, Modelling and Equipment - Bog - Hardback

Techniques and Challenges for 300 mm Silicon: Processing, Characterization, Modelling and Equipment

Includes papers that cover the E-MRS conference on Techniques and Challenges for 300 mm Silicon: Processing, Characterization, Modeling and Equipment. This book covers a wide range of subjects, financial issues, fab concepts, crystal growth, wafer process development, material and defect issues, and wafer characterization.