Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore - Bog af Hengyun (Shanghai University of Engineering Science Zhang - Pape

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Mærke	Elsevier Science & Technology
EAN / Stregkode	9780081025321
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Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore - Hengyun (Shanghai University of Engineering Science Zhang

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DKK 2676.95

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